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Shanghai BIM & AIA AEC Hackathon


  • 2889 Jinke Road No. 3 Shanghai China (map)
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ShanghaiBIM's second annual hackathon was held on November 2017 24 - 26 in the Shanghai Taicang Innovation Space.  This competition brought together creators and technologists to solve technical problems unique to the AEC industry.  

Examples of challenges include the following: 

  • Flexible manufacturing in the home industry 
  • Using Autodesk fusion 360 in the era of customizations
  • 3D Spatial techniques of building large scale interiors 
  • Web application development of BIM data services via Genie platform

Prizes were awarded as follows:

First prize: 1, 8000 yuan
Second Prize: 4000 yuan
Third Prize: 1500 yuan

Event Photos

 

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